MicroCut X

The most productive, most accurate and fastest cutting system for SMT stencils

The MicroCut X sets new standards in the production of stencils with its integrated deflection technology. Thereby both performance and quality are significantly improved with the new system.

This is the new MicroCut X

LPKFs MicroCut X is the new flagship for the production of stencils using laser technology. The new StencilLaser system is the result of LPKF's many years of experience in the field of stencil production and the subsequent optimization and further development of the system to meet current and future market requirements.

The combination of the scanner-guided laser with LPKF's proven StencilLaser technologies opens up new possibilities and top performance values in the production of stencils. The new system demonstrates its advantages especially with smaller apertures combined with high packing densities. In addition to highly precise apertures with perfect geometries, performance gains of around 50% can also be achieved e.g. for wafer stencils. In terms of effectiveness and efficiency, this ensures new and much improved conditions for our customers.

Advantages of MicroCut X

The MicroCut X combines the proven LPKF StencilLaser technologies with innovative scanner technology and thus offers several significant advantages over the accompanying systems on the market:

Real-Time Process Control

Thanks to the Real-Time Process Control developed by LPKF, every opening is checked in real time. The system is able to detect a deviation in production data in real time, adjust the cutting parameters and thus avoid unnecessary downtimes.

Scanning Technology

Experience unmatched speed with LPKF MicroCut X’s scanning technology. Its rapid scanning ensures faster processing for high packing densities and optimal efficiency.

Automatic frame adjustment

No stencil adapter is required for the automatic loading of the StencilLaser G6080. Select the desired frame and press OK. The holder adapts to the new shape in less than 10 seconds. This saves you valuable production time and makes you independent of the positioning of the stencil.

Dynamic Design

The innovative dynamic design increases output performance by up to 20 %. In combination with the low maintenance requirements, you will experience stencil production in unsurpassed best time.

Low energy consumption

LPKF LongLife fiber laser technology reduces the system's energy consumption by up to 30% as it relies entirely on air cooling. Downtimes due to maintenance work on external cooling systems are also avoided.

Automatic Cutting Gas Management Technology

The MicroCut X uses either compressed air or oxygen as the cutting medium. In the standard integrated automatic mode, two different cutting gases can be used in parallel. Gas selection, pressure setting and process monitoring are all fully automatic.

Flexible adjustment of opening shapes and dimensions

The LPKF EasyEdit software was specially developed for stencil production and is one of the most versatile and powerful programs on the market. It enables easy implementation of customer requirements. Opening shapes and sizes can be modified globally or individually. The opening dimensions are freely adjustable and special programs are available for special solutions.

Technical data

	MicroCut X
Cutting range	600 mm x 800 mm (23.6" x 31.5")
Max. frame size	740 mm x 1000 mm x 40 mm (29.1" x 39.4" x 1.6")
Max. material thickness	up to 1 mm
Axis accuracy	+/- 2 µm
System dimensions (W x H x D)	1530 mm x 1920 mm x 1625 mm (61" x 75" x 64")
System weight	approx. 2200 kg

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Brochure

Brochure LPKF StencilLaser (pdf - 722 KB)

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MicroCut X

The most productive, most accurate and fastest cutting system for SMT stencils

This is the new MicroCut X

Advantages of MicroCut X

Technical data

Downloads

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