More extensive possibilities for the production of SMD stencils

  • Increased cutting range of 600 mm x 1200 mm
  • High and constant precision 
  • Wide range of processable materials
  • Real time inspection of apertures

LPKF StencilLaser G 60120

Precision meets efficiency: New flagship for cutting SMD stencils

The LPKF StencilLaser G 60120 is based on the proven and field-tested StencilLaser platform G 6080 and offers the outstanding precision and performance for an enlarged cutting area. The high cost-effectiveness and suitability for a wide range of applications make the system a worthwhile investment.


This is the StencilLaser G 60120

The LPKF StencilLaser G 60120 offers an extended cutting range for the production of SMD stencils based on the proven platform of the StencilLaser G 6080. The new system is the result of LPKF's many years of experience in the field of stencil production and the optimization and further development of the system based on this knowledge.

A characteristic feature of the system is the enlarged cutting area. Thanks to an ultra-light and reliable axis structure made of carbon fiber, the system is designed for both performance and quality. As a result, the G 60120 features inimitable performance combined with high precision as well as repeatability, while offering the ability to produce SMD stencils for a wider range of applications.

To meet the high and diverse requirements of customers, the StencilLaser G 60120 is equipped with various features such as automatic frame adjustment, cutting gas management technology and real-time process control.

 Advantages of StencilLaser G 60120

The StencilLaser G 60120 combines the most innovative technologies of the StencilLaser G 6080 with a large cutting area, offering a broad range of advantages:
Extensive workspace

The depth extension of the StencilLaser G 60120 offers an increased cutting area of 600 x 1200 mm while maintaining the same performance and quality. This makes the system suitable for further stencil applications such as 5G antennas or large LED lightings.

Real-Time Process Control

Thanks to the integrated Real-Time Process Control developed by LPKF, every cutted aperture is checked in real time. Thereby the system is able to detect a deviation from production data and adjust the cutting parameters in real time, thus avoiding unnecessary downtime.

Automatic frame adjustment

No stencil adapter is required for automatic placement in the the StencilLaser G 60120. The required frame can be simply selected. The holder adapts to the new shape in less than 10 seconds. This saves valuable production time and makes you independent of the positioning of the stencil.

Dynamic design

The innovative and dynamic design of the system increases output performance by up to 20%. Combined with low maintenance, you will experience stencil production in unmatched best time.

Low energy consumption

Especially LPKFs LongLife fiber laser technology reduces system energy consumption by up to 30% by relying entirely on air cooling. Downtimes due to maintenance work on external cooling systems are thus also avoided.

Cutting Gas Management Technology

The StencilLaser G 60120 is standardly equipped with cutting gas management and can control multiple gases such as compressed air or oxygen as cutting medium. In automatic mode, two different cutting gases can be used in parallel. Gas selection, pressure settings and process monitoring are all designed fully automatic.

Technical Data

 StencilLaser G 60120
Cutting range600 mm x 1200 mm (23.6" x 47.2")
Max. Frame size750 mm x 1500 mm  (29.5" x 59")
Max. Material thicknessup to 1 mm
Axis accuracy+/- 2 µm
System dimensions (W x H x D)1530 mm x 1920 mm x 2020 mm (61" x 75" x 79.5")
Weightapprox. 2450 kg

Image gallery


Flyer StencilLaser G 60120 (pdf - 198 KB)

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